Job Id: 1064
Top 5 Required Skills
1. 12+ years actively involved in PWB design for high-density electronics packaging.
2. 10+ years' experience in a PWB design role designing consumer-grade mobile products or low volume test products utilizing latest generation processor chips & ICs.
3. Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.
4. Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages
5. Experience working include working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem, Auto, Compute, Infrastructure and IOT
Education Requirement
• Associate's degree in a Technical Field, Electronics preferred
Keywords
• PWB, RF, radio circuits as well as power control devices.
• Preferred design experience: RF, Analog, High-speed digital circuits – DDR2, 3 & 4, LPDDR5, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE
Technologies
• Siemens/Mentor Xpedition,
• PADS and / or Cadence Allegro PWB design software